Category: IPC

Requirements and Acceptance for Cable and Wire Harness Assembliesstandard by Association Connecting Electronics Industries, 01/01/2017

Small Hole Reliability Round Robin Artworkstandard by Association Connecting Electronics Industries, 09/01/1988

User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulationstandard by Association Connecting Electronics Industries, 12/01/2010

Rework, Modification and Repair of Electronic Assembliesstandard by Association Connecting Electronics Industries, 01/01/2017

Guidelines for Design, Selection and Application of Conformal CoatingsHandbook / Manual / Guide by Association Connecting Electronics Industries, 08/01/2013

Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boardsstandard by Association Connecting Electronics Industries, 05/01/2006

Chip Scale and BGA National Symposium Proceedings 1999Conference Proceeding by Association Connecting Electronics Industries, 05/01/1999

Specification for Immersion Tin Plating for Printed Circuit Boardsstandard by Association Connecting Electronics Industries, 01/01/2007

Standard for Manufacturing and Supply Chain Traceability of Electronic Productsstandard by Association Connecting Electronics Industries, 10/01/2016

User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testingstandard by Association Connecting Electronics Industries, 06/01/2016