Category: IPC

Specifications for High Density Interconnect (HDI) and Microvia Materialsstandard by Association Connecting Electronics Industries, 05/01/1999

Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiringstandard by Association Connecting Electronics Industries, 06/01/2016

Design Guide for Embedded Passive Device Printed BoardsHandbook / Manual / Guide by Association Connecting Electronics Industries, 03/01/2007

IPC National Conference Flexible Circuits Volume I & II - Denver, CO 1999Conference Proceeding by Association Connecting Electronics Industries, 01/01/1999

Guidelines for Design, Selection and Application of Conformal CoatingsHandbook / Manual / Guide by Association Connecting Electronics Industries, 10/01/2002

Specification for Base Materials for High Speed/High Frequency Applications with Amendment 1standard by Association Connecting Electronics Industries, 01/01/2014

Semiconductor Design Standard for Flip Chip Applicationsstandard by Association Connecting Electronics Industries, 04/01/1999

Printed Wiring Board Strain Gage Test Guidelinestandard by Association Connecting Electronics Industries, 06/01/2005

Troubleshooting for Printed Board Assembly Processesstandard by Association Connecting Electronics Industries, 01/01/2019

IPC Phase 3 Controlled Atmosphere Soldering Studystandard by Association Connecting Electronics Industries, 08/01/1994