Category: IPC

Requirements for Soldered Electrical and Electronic Assemblies with Amendment 1standard by Association Connecting Electronics Industries, 04/01/2016

Selection and Application of Board Level Underfill Materialsstandard by Association Connecting Electronics Industries, 02/01/2014

Guidelines for Cleaning of Printed Boards and AssembliesHandbook / Manual / Guide by Association Connecting Electronics Industries, 07/01/2011

Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guidelinestandard by Association Connecting Electronics Industries, 09/01/2004

Generic Requirements for Surface Mount Land Pattern and Design Standard - INCLUDES LAND PATTERN VIEWER SOFTWAREstandard by Association Connecting Electronics Industries,

Standards for Printed Board Materials Manualstandard by Association Connecting Electronics Industries,

Selection and Implementation Strategy for a Low-Residue, No-Clean Processstandard by Association Connecting Electronics Industries, 12/01/1998

Bare Board Electrical Test - VIDEOstandard by Association Connecting Electronics Industries, 04/01/1998

Design Guidelines for Reliable Surface Mount Technology Printed Board AssembliesHandbook / Manual / Guide by Association Connecting Electronics Industries, 08/01/1996

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires, Includes Amendment 1 (November 2008)standard by Association Connecting Electronics Industries, 12/01/2007