IPC 6012D-AM1
Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1standard by Association Connecting Electronics Industries, 09/01/2017
IPC 2581B-WAM1
Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodologystandard by Association Connecting Electronics Industries, 12/01/2016
IPC J-STD-001FS WAM1
Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic AssembliesAmendment by Association Connecting Electronics Industries, 2017
IPC HDBK-4691
Handbook on Adhesive Bonding in Electronic Assembly Operationsstandard by Association Connecting Electronics Industries, 11/01/2015
IPC PD-335
Electronic Packaging Handbookstandard by Association Connecting Electronics Industries, 01/01/1989
IPC J-STD-013
Implementation of Ball Grid Array and Other High Density Technologystandard by Association Connecting Electronics Industries, 08/01/1996
IPC EMSI-TC2
IPC Sample Master Ordering Agreement for EMS Companies and OEMsstandard by Association Connecting Electronics Industries, 03/01/2002
IPC HERMES-9852
The Global Standard for Machine-to-Machine Communication in SMT Assemblystandard by Association Connecting Electronics Industries, 06/01/2019