Category: IPC

Analysis of the Market for Rigid Printed Wiring Boards and Related Materials for 1999Report / Survey by Association Connecting Electronics Industries, 06/27/2000

Terms & Definitions, Test Methods, and Design Examples for Buld-Up/High Density Interconnect (HDI) Printed Wiring Boardsstandard by Association Connecting Electronics Industries, 01/01/2000

Statistical Process Control (SPC) Quality Ratingstandard by Association Connecting Electronics Industries, 09/01/2002

Accelerated Aging for Solderability Evaluationsstandard by Association Connecting Electronics Industries, 12/01/1987

Specifications for Base Materials for Rigid and Multilayer Printed Boards (Includes Amendment 1)standard by Association Connecting Electronics Industries, 06/01/2002

Environmental Best Practices Guidestandard by Association Connecting Electronics Industries,

Generic Requirements for Electronic Manufacturing Supply Chain Communication - Product Data eXchange (PDX)standard by Association Connecting Electronics Industries, 11/01/2001

Standard for Determining Current Carrying Capacity in Printed Board Design (Designrichtlinie für die Bestimmung der Stromtragfähigkeit von Leiterplatten)standard by Association Connecting Electronics Industries, 05/01/2010

Standard for Determining Current Carrying Capacity in Printed Board Designstandard by Association Connecting Electronics Industries, 08/01/2009

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards with Amendments 1 and 2standard by Association Connecting Electronics Industries, 12/01/2012