Category: IPC

Sectional Design Standard for Flexible/Rigid-Flexible Printed Boardsstandard by Association Connecting Electronics Industries, 09/01/2016

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wiresstandard by Association Connecting Electronics Industries, 11/01/2017

Rework of Electronic Assemblies & Repair and Modification of Printed Boards and Electronic Assembliesstandard by Association Connecting Electronics Industries, 04/01/1998

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wiresstandard by Association Connecting Electronics Industries, 02/01/2003

Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplasticsstandard by Association Connecting Electronics Industries, 01/01/2018

IPC International Conference on Embedded Passives "The Faster and Cleaner Electronic Signals for the Future" - Northbrook, IL - June 2003Conference Proceeding by Association Connecting Electronics Industries, 07/01/2003

Requirements for Woven and Knitted Electronic Textiles (E-Textiles) Integrated with Conductive Fibers, Conductive Yarns and/or Wiresstandard by Association Connecting Electronics Industries, 10/01/2019

Design Guide for High Density Interconnects & MicroviasHandbook / Manual / Guide by Association Connecting Electronics Industries, 06/01/2000

General Specification for Encapsulated Discrete Wire Interconnection Boardsstandard by Association Connecting Electronics Industries, 01/01/1995

Terms & Definitions, Test Methods, and Design Examples for Buld-Up/High Density Interconnect (HDI) Printed Wiring Boardsstandard by Association Connecting Electronics Industries, 01/01/2000