IPC MC-790
Guidelines for Multichip Module Technology Utilizationstandard by Association Connecting Electronics Industries, 08/01/1992
IPC 7095D-WAM1
Design and Assembly Process Implementation for BGAs, with Amendment 1standard by Association Connecting Electronics Industries, 06/01/2019
IPC D-350D
Printed Board Description in Digital Formstandard by Association Connecting Electronics Industries, 07/01/1992
IPC TA-721
Technology Assessment Handbook on Multilayer Boardsstandard by Association Connecting Electronics Industries,
IPC 1752A-WAM1-2
Materials Declaration Management with Amendments 1 & 2standard by Association Connecting Electronics Industries, 02/01/2014