IPC MC-790
Guidelines for Multichip Module Technology Utilizationstandard by Association Connecting Electronics Industries, 08/01/1992
BS PIP AWS SAIA AWPA ASSE
IPC
Guidelines for Multichip Module Technology Utilizationstandard by Association Connecting Electronics Industries, 08/01/1992
Design and Assembly Process Implementation for BGAs, with Amendment 1standard by Association Connecting Electronics Industries, 06/01/2019
Printed Board Description in Digital Formstandard by Association Connecting Electronics Industries, 07/01/1992
Materials Declaration Management with Amendments 1 & 2standard by Association Connecting Electronics Industries, 02/01/2014
Specification for Immersion Tin Plating for Printed Circuit Boards with Amendment 1standard by Association Connecting Electronics Industries, 01/01/2012