Category: IPC

Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)standard by Association Connecting Electronics Industries, 05/01/1998

IPC/SOLDERTEC International Conference on Lead Free Electronics "Towards Implementation of the RHS Directive" (Brussels, Belgium - June 2003)Conference Proceeding by Association Connecting Electronics Industries, 07/01/2003

Requirements for Power Conversion Devices for the Computer and Telecommunications Industriesstandard by Association Connecting Electronics Industries, 09/01/2008

Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)standard by Association Connecting Electronics Industries, 03/01/2017

Acceptability of Printed Boardsstandard by Association Connecting Electronics Industries, 05/01/2016

Requirements for Soldering Fluxesstandard by Association Connecting Electronics Industries, 02/28/2012

Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assembliesstandard by Association Connecting Electronics Industries, 07/01/2017

Specification for Multilayer Hybrid Circuitsstandard by Association Connecting Electronics Industries, 01/10/1987

Printed Board Dimensions and Tolerancesstandard by Association Connecting Electronics Industries, 07/01/2000

Printed Circuit Assembly Strain Gage Test Guidelinestandard by Association Connecting Electronics Industries, 02/01/2012