IPC TR-481
Results of Multilayer Test Program Round Robinstandard by Association Connecting Electronics Industries, 04/01/1981
BS PIP AWS SAIA AWPA ASSE
IPC
Results of Multilayer Test Program Round Robinstandard by Association Connecting Electronics Industries, 04/01/1981
The Effect of Steam Aging Time and Temperature on Solderability Test Resultsstandard by Association Connecting Electronics Industries, 01/01/1993
Solderability Tests for Printed Boards with Amendment 1standard by Association Connecting Electronics Industries, 05/01/2014
IPC/SOLDERTEC International Conference on Lead Free Electronics "Towards Implementation of the RHS Directive" (Brussels, Belgium - June 2003)Conference Proceeding by Association Connecting Electronics Industries, 07/01/2003