Category: IPC

Results of Multilayer Test Program Round Robinstandard by Association Connecting Electronics Industries, 04/01/1981

The Effect of Steam Aging Time and Temperature on Solderability Test Resultsstandard by Association Connecting Electronics Industries, 01/01/1993

Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boardsstandard by Association Connecting Electronics Industries, 09/01/2017

General Guidelines for Implementation of Statistical Process Control (SPC)standard by Association Connecting Electronics Industries, 11/01/1999

Solderability Tests for Printed Boards with Amendment 1standard by Association Connecting Electronics Industries, 05/01/2014

Specifications for Base Materials for Rigid and Multilayer Printed Boardsstandard by Association Connecting Electronics Industries, 12/10/1997

Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)standard by Association Connecting Electronics Industries, 05/01/1998

IPC/SOLDERTEC International Conference on Lead Free Electronics "Towards Implementation of the RHS Directive" (Brussels, Belgium - June 2003)Conference Proceeding by Association Connecting Electronics Industries, 07/01/2003

Requirements for Power Conversion Devices for the Computer and Telecommunications Industriesstandard by Association Connecting Electronics Industries, 09/01/2008

Sectional Requirements for Shop Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Test, Inspection and Reworkstandard by Association Connecting Electronics Industries, 01/01/2002