Category: IPC

Specification for Base Materials for Rigid and Multilayer Printed Boardsstandard by Association Connecting Electronics Industries, 04/01/2014

Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boardsstandard by Association Connecting Electronics Industries, 08/01/2017

Conflict Minerals Data Exchange StandardAmendment by Association Connecting Electronics Industries, 05/08/2017

Design and Assembly Process Implementation for BGAsstandard by Association Connecting Electronics Industries, 03/01/2008

Sectional Design Standard for High Density Interconnect (HDI) Boardsstandard by Association Connecting Electronics Industries, 05/01/2003

2000 Technology Trends for Printed Wiring BoardsReport / Survey by Association Connecting Electronics Industries, 01/01/2000

Printed Board Quality Evaluation Handbookstandard by Association Connecting Electronics Industries, 02/01/1999

Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehiclestandard by Association Connecting Electronics Industries, 05/01/2012

Results of Multilayer Test Program Round Robinstandard by Association Connecting Electronics Industries, 04/01/1981

The Effect of Steam Aging Time and Temperature on Solderability Test Resultsstandard by Association Connecting Electronics Industries, 01/01/1993