IPC 4101D-WAM1
Specification for Base Materials for Rigid and Multilayer Printed Boards with Amendment 1standard by Association Connecting Electronics Industries, 07/01/2015
BS PIP AWS SAIA AWPA ASSE
IPC
Specification for Base Materials for Rigid and Multilayer Printed Boards with Amendment 1standard by Association Connecting Electronics Industries, 07/01/2015
Automated Design Guidelinesstandard by Association Connecting Electronics Industries, 02/01/1988
Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackagesstandard by Association Connecting Electronics Industries, 09/01/2005
Cleaning Methods and Contamination Assessment for Optical Assemblystandard by Association Connecting Electronics Industries, 01/01/2006