IPC A-610FC-Telecom(D)1
Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic AssembliesAmendment by Association Connecting Electronics Industries, 01/01/2017
BS PIP AWS SAIA AWPA ASSE
IPC
Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic AssembliesAmendment by Association Connecting Electronics Industries, 01/01/2017
Automated Design Guidelinesstandard by Association Connecting Electronics Industries, 02/01/1988
Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackagesstandard by Association Connecting Electronics Industries, 09/01/2005