IPC J-STD-001C
Requirements for Soldered Electrical and Electronic Assembliesstandard by Association Connecting Electronics Industries, 03/01/2000
BS PIP AWS SAIA AWPA ASSE
IPC
Requirements for Soldered Electrical and Electronic Assembliesstandard by Association Connecting Electronics Industries, 03/01/2000
Automated Design Guidelinesstandard by Association Connecting Electronics Industries, 02/01/1988
Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackagesstandard by Association Connecting Electronics Industries, 09/01/2005
Cleaning Methods and Contamination Assessment for Optical Assemblystandard by Association Connecting Electronics Industries, 01/01/2006