Category: IPC

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wiresstandard by Association Connecting Electronics Industries, 06/01/2013

Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Filmsstandard by Association Connecting Electronics Industries, 05/01/2002

Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosuresstandard by Association Connecting Electronics Industries, 09/01/2013

Standards for Printed Board Assembly Manualstandard by Association Connecting Electronics Industries,

IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Printed Circuit Boards and Assemblies (Correcting the Misunderstandings on "Halogen-Free")standard by Association Connecting Electronics Industries, 08/01/2007

Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic AssembliesAmendment by Association Connecting Electronics Industries, 01/01/2017

Requirements for Soldered Electrical and Electronic Assembliesstandard by Association Connecting Electronics Industries, 10/31/2017

Qualification and Performance Specification for Rigid Printed Boardsstandard by Association Connecting Electronics Industries, 02/01/2020

Qualification and Performance Specification for High Frequency (Microwave) Printed Boardsstandard by Association Connecting Electronics Industries, 07/01/2016

Specification for Base Materials for Rigid and Multilayer Printed Boards with Amendment 1standard by Association Connecting Electronics Industries, 07/01/2015