Category: IPC

Surface Mount Placement Equipment Characterizationstandard by Association Connecting Electronics Industries, 11/01/2011

Design and Assembly Process Implementation for BGAsstandard by Association Connecting Electronics Industries, 01/01/2013

Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boardsstandard by Association Connecting Electronics Industries, 08/01/2018

TM-650 - Test Methods Manualstandard by Association Connecting Electronics Industries,

Specification for Immersion Silver Plating for Printed Boardsstandard by Association Connecting Electronics Industries, 05/01/2009

Qualification and Performance Specification for Flexible Printed Boardsstandard by Association Connecting Electronics Industries,

Cleaning Alternatives Artworkstandard by Association Connecting Electronics Industries,

Requirements for Power Conversion Devices for the Computer and Telecommunications Industriesstandard by Association Connecting Electronics Industries, 11/01/2012

Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boardsstandard by Association Connecting Electronics Industries, 01/01/2013

Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separationsstandard by Association Connecting Electronics Industries, 07/01/2001