Category: IPC

Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boardsstandard by Association Connecting Electronics Industries, 08/01/2018

Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosuresstandard by Association Connecting Electronics Industries, 06/01/2014

Surface Mount Placement Equipment Characterizationstandard by Association Connecting Electronics Industries, 11/01/2011

Cleaning Alternatives Artworkstandard by Association Connecting Electronics Industries,

Requirements for Power Conversion Devices for the Computer and Telecommunications Industriesstandard by Association Connecting Electronics Industries, 11/01/2012

TM-650 - Test Methods Manualstandard by Association Connecting Electronics Industries,

Specification for Immersion Silver Plating for Printed Boardsstandard by Association Connecting Electronics Industries, 05/01/2009

Qualification and Performance Specification for Flexible Printed Boardsstandard by Association Connecting Electronics Industries,

Terms and Definitions for Interconnecting and Packaging Electronic Circuitsstandard by Association Connecting Electronics Industries, 07/01/2008

Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boardsstandard by Association Connecting Electronics Industries, 01/01/2013